Hiratsuka, Japan

Hiroyuki Idenawa


Average Co-Inventor Count = 2.6

ph-index = 11

Forward Citations = 429(Granted Patents)


Location History:

  • Tokyo, JP (1979 - 1986)
  • Hiratsuka, JP (1988 - 1991)
  • Kanagawa, JP (2000)

Company Filing History:


Years Active: 1979-2000

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11 patents (USPTO):Explore Patents

Title: Hiroyuki Idenawa: Innovator in Adhesive Technologies

Introduction

Hiroyuki Idenawa is a prominent inventor based in Hiratsuka, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 11 patents. His innovative work focuses on methods and apparatuses that enhance the functionality of thermosensitive adhesive labels and automatic cut-sheet feeding systems.

Latest Patents

Idenawa's latest patents include a heat activation method for thermosensitive adhesive labels. This method involves activating a thermosensitive adhesive layer that is non-adhesive at room temperature. The process requires heating the adhesive layer while it is in contact with a heat-resistant transporting belt, ensuring that the adhesive becomes functional through the application of heat. Additionally, he has developed an automatic cut-sheet feeding apparatus that efficiently feeds the uppermost cut-sheet from a stack while preventing excessive sheets from being fed out simultaneously.

Career Highlights

Hiroyuki Idenawa is associated with Ricoh Company, Ltd., where he has been instrumental in advancing adhesive technologies. His work has not only improved the efficiency of label printing but has also streamlined the process of feeding cut-sheets in various applications.

Collaborations

Idenawa has collaborated with notable coworkers such as Tatsuo Tani and Takashi Yano. Their combined expertise has contributed to the successful development of innovative solutions in their respective fields.

Conclusion

Hiroyuki Idenawa's contributions to adhesive technologies and automatic feeding systems highlight his role as a key innovator in the industry. His patents reflect a commitment to enhancing functionality and efficiency in practical applications.

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