Osaka, Japan

Hiroyuki Chijiwa

This inventor holds 1 USPTO granted patent and 4 published patent applications and 2 EPO patents. Top assignee: Dic Corporation. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Chijiwa. Retrieved from https://idiyas.com/inventor/hiroyuki-chijiwa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Hiroyuki Chijiwa: Innovator in Aqueous Resin Technology

Introduction

Hiroyuki Chijiwa is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of resin technology, particularly with his innovative aqueous resin compositions. His work has implications for various applications, including fiber laminates.

Latest Patents

Hiroyuki Chijiwa holds 1 patent for his invention titled "One-pack type aqueous resin composition and fiber laminate." This invention provides a one-component aqueous resin composition that includes an aqueous urethane resin with specific properties. The composition exhibits excellent adhesiveness and resistance to moist heat without the need for a crosslinking agent.

Career Highlights

Chijiwa is associated with Dic Corporation, where he has been able to apply his expertise in resin technology. His work has contributed to advancements in the manufacturing and application of fiber laminates, showcasing his innovative approach to material science.

Collaborations

Chijiwa has collaborated with notable coworkers such as Tomohiro Tetsui and Norie Fujishita. Their combined efforts have furthered research and development in the field of aqueous resin compositions.

Conclusion

Hiroyuki Chijiwa's contributions to aqueous resin technology highlight his role as an innovator in the industry. His patent reflects a significant advancement in material science, demonstrating the potential for improved applications in various fields.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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