Iwakuni, Japan

Hiroyuki Arita

This inventor holds 1 USPTO granted patent. Top assignee: Mitsui Petrochemical Industries, Ltd.. Active years: 1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Arita. Retrieved from https://idiyas.com/inventor/hiroyuki-arita-vft3alys

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1989

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1 patent (USPTO):Explore Patents

Title: Hiroyuki Arita and His Synthetic Fiber Bundle Patent

Introduction

Hiroyuki Arita is an inventor associated with Iwakuni, Japan, and Mitsui Petrochemical Industries, Ltd. His recorded patent concerns a process for preparing synthetic fiber bundles.

Latest Patents

Arita’s listed patent is “Process for Preparation of a Synthetic Fiber Bundle.” The invention melt-kneads a non-water-swelling or water-insoluble thermoplastic resin with water and an assistant that helps disperse the water through the resin. The composition is extruded through an orifice under conditions that prevent the water from flashing. The assistant may be a water-soluble resin or a water-insoluble resin containing a carboxylic acid salt group, optionally combined with a surface-active agent. The resulting bundle consists of parallel filaments less than 100 micrometers in diameter and is designed to open easily. Arita is associated with 1 patent.

Career Highlights

Arita’s recorded work connects polymer processing with the production of fine, easily opened synthetic fiber bundles. His patent identifies Mitsui Petrochemical Industries, Ltd. as his company.

Collaborations

Arita’s listed coworkers include Shiro Homma and Masatoshi Kashiwagi.

Conclusion

Hiroyuki Arita’s patent describes a controlled melt-kneading and extrusion process for producing fine synthetic fiber bundles that can be opened easily.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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