Kanagawa, Japan

Hiroyasu Taniguchi

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Tanaka Kikinzoku Kogyo K.k.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyasu Taniguchi. Retrieved from https://idiyas.com/inventor/hiroyasu-taniguchi-r8wswxa8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Hiroyasu Taniguchi: Innovator in Brazing Materials

Introduction

Hiroyasu Taniguchi is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of brazing materials, particularly with his innovative approach to creating alloys that enhance device packaging.

Latest Patents

Taniguchi holds a patent for an Au—Ga—In brazing material. This unique brazing material can be melted at a temperature that does not damage the device inside a package during sealing. Additionally, it remains unmelted during the mounting process to a board, showcasing its stability. The material is composed of a ternary alloy with specific weight concentrations of gold (Au), gallium (Ga), and indium (In), which lie within a defined region of a phase diagram.

Career Highlights

Taniguchi is associated with Tanaka Kikinzoku Kogyo K.K., a company known for its advancements in metal and material technologies. His work has led to the development of materials that are crucial for modern electronic devices, ensuring their reliability and performance.

Collaborations

Throughout his career, Taniguchi has collaborated with talented individuals such as Tomohiro Shimada and Kenichi Miyazaki. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Hiroyasu Taniguchi's contributions to brazing materials exemplify the importance of innovation in technology. His work not only enhances device packaging but also sets a standard for future developments in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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