This inventor holds 2 USPTO granted patents. Top assignee: Denso Corporation. Active years: 2002-2003.
Company Filing History:
Years Active: 2002-2003
Title: Hiroyasu Iwama: Innovator in Thermoplastic Resin Technology
Introduction
Hiroyasu Iwama is a notable inventor based in Anjo, Japan. He has made significant contributions to the field of thermoplastic resin technology, holding 2 patents that showcase his innovative approach to bonding methods and interconnection structures.
Latest Patents
Iwama's latest patents include a bonding method and bonding structure of thermoplastic resin material. This invention involves a PEI film that is bonded to a glass epoxy substrate through an alkane film. The process requires heating the interface to a temperature above the glass transition point Tg of the PEI film, which results in the formation of an adhesion-improving layer. This layer enhances adhesive strength due to its lower elastic modulus compared to the PEI film.
Another significant patent by Iwama is a method for interconnecting printed circuit boards. This method involves preparing two printed circuit boards, where the first has an insulating substrate made of thermoplastic resin and a conductive pattern. The second board also has a conductive pattern. The lands of both boards are overlapped to form an interconnection portion, which is then heated and pressed to create a sealed electrical interconnection.
Career Highlights
Hiroyasu Iwama is currently employed at Denso Corporation, where he continues to develop innovative solutions in his field. His work has contributed to advancements in the manufacturing and functionality of electronic components.
Collaborations
Iwama has collaborated with notable coworkers such as Toshihiro Miyake and Katsuaki Kojima, further enhancing the innovative environment at Denso Corporation.
Conclusion
Hiroyasu Iwama's contributions to thermoplastic resin technology and printed circuit board interconnections highlight his role as a leading inventor in the industry. His patents reflect a commitment to improving adhesive methods and electronic connectivity, showcasing the importance of innovation in modern technology.