Company Filing History:
Years Active: 2019
Title: Hiroya Ishikawa: Innovator in Solder Materials
Introduction
Hiroya Ishikawa is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of solder materials, particularly in the development of innovative alloys. His work is recognized for its technical precision and practical applications in electronic components.
Latest Patents
Hiroya Ishikawa holds a patent for a solder material that includes an alloy of at least five elements, including Sn, Cu, Sb, and In, with 20 mass % or less of Ag. The solidus temperature of this solder material is higher than 290°C, while the liquidus temperature is 379°C or less and is higher than the solidus temperature. Notably, the temperature difference between the liquidus and solidus temperatures is 70°C or less. This innovation enhances the reliability and performance of electronic components.
Career Highlights
Ishikawa is associated with Nihon Dempa Kogyo Co., Ltd., where he has been instrumental in advancing solder technology. His expertise in materials science has led to the development of products that meet the evolving demands of the electronics industry.
Collaborations
Some of his coworkers include Toshimasa Tsuda and Kenichi Kikuchi, who have collaborated with him on various projects within the company. Their combined efforts contribute to the innovative environment at Nihon Dempa Kogyo Co., Ltd.
Conclusion
Hiroya Ishikawa's contributions to solder materials exemplify the importance of innovation in the electronics sector. His patented work not only showcases his expertise but also enhances the functionality of electronic components.