The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Feb. 03, 2016
Applicant:
Nihon Dempa Kogyo Co., Ltd., Tokyo, JP;
Inventors:
Toshimasa Tsuda, Saitama, JP;
Kenichi Kikuchi, Saitama, JP;
Tomotaka Kuroda, Saitama, JP;
Daisuke Nishiyama, Saitama, JP;
Hiroyuki Sasaki, Saitama, JP;
Makoto Hatano, Saitama, JP;
Hiroya Ishikawa, Saitama, JP;
Assignee:
NIHON DEMPA KOGYO CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 30/02 (2006.01); C22C 30/04 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 30/02 (2013.01); C22C 30/04 (2013.01);
Abstract
A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290° C., the liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.