Kusatsu, Japan

Hirotoshi Tanimura

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirotoshi Tanimura. Retrieved from https://idiyas.com/inventor/hirotoshi-tanimura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2002

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovative Mind – Hirotoshi Tanimura

Introduction

Hirotoshi Tanimura, an inventive force hailing from Kusatsu, Japan, has made noteworthy advancements in the field of electronics. His work focuses on improving electronic packaging, particularly through efficient heat transfer solutions.

Latest Patents

Tanimura holds a significant patent titled "Electronic package with plurality of solder-applied areas providing heat transfer." This innovation details an electronic package incorporating essential components such as a heat dissipating surface, often a metal layer found in LSI chip modules. The design positions the heat dissipating surface adjacent to a specially configured heat transfer area on a printed wiring board. This area features a pattern of solder-applied areas, ensuring effective bonding with the heat dissipating layer for optimal heat transfer. Additionally, Tanimura's work includes the innovative use of through holes in the board to enhance heat removal further, thus paving the way for more efficient electronic devices.

Career Highlights

Hirotoshi Tanimura is affiliated with International Business Machines Corporation (IBM), a company renowned for its technological leadership and commitment to innovation. His contributions at IBM are indicative of his dedication to advancing electronic solutions that are both practical and pioneering. Tanimura’s solitary patent exemplifies his ability to push the envelope of current technologies, reflecting his expertise and innovative spirit.

Collaborations

Throughout his career, Tanimura has collaborated with esteemed colleagues such as Keiichi Ohtsubo and Shinji Ueno. These partnerships have likely enriched his work environment, fostering a collaborative atmosphere that breeds creativity and further innovation in the realm of electronic packaging.

Conclusion

Hirotoshi Tanimura stands out as an inventor whose work significantly contributes to the efficiency and functionality of electronic packages. His patent enhances heat transfer methods, a crucial aspect in the ever-evolving tech landscape. With collaborations alongside proficient colleagues in a reputable organization like IBM, Tanimura's future endeavors in the field of electronics will be keenly anticipated by industry followers and professionals alike.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…