Ageo, Japan

Hiroto Iida

This inventor holds 1 USPTO granted patent. Top assignee: Mitsui Mining & Smelting, Ltd. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroto Iida. Retrieved from https://idiyas.com/inventor/hiroto-iida-jitw529m

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hiroto Iida: Innovator in Laminate Production

Introduction

Hiroto Iida is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of laminate production, particularly through his innovative methods that enhance the adhesion between copper foil and resin films.

Latest Patents

Hiroto Iida holds a patent for a "Method for producing laminate and heating element, and defroster." This patent describes a method that utilizes a polyvinyl acetal resin with low reactivity to copper foil. The process involves providing a copper foil with a treated surface containing a specific range of metal components, followed by the attachment or formation of a resin film to create a durable laminate.

Career Highlights

Iida is currently employed at Mitsui Mining & Smelting, Ltd., where he continues to develop and refine his innovative techniques. His work has been instrumental in advancing the technology used in laminate production.

Collaborations

Hiroto Iida collaborates with esteemed colleagues such as Makoto Hosokawa and Toshiyuki Shimizu. Their combined expertise contributes to the ongoing success and innovation within their field.

Conclusion

Hiroto Iida's contributions to laminate production exemplify the importance of innovation in material science. His patented methods not only improve product quality but also pave the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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