Machida, Japan

Hiroshi Wada

This inventor holds 1 USPTO granted patent. Top assignee: Dai-Ichi Seiko Co., Ltd.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Wada. Retrieved from https://idiyas.com/inventor/hiroshi-wada-lurrk41t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Hiroshi Wada: Inventor of an Improved Electric Connector.

Introduction

Hiroshi Wada is an inventor associated with Machida, Japan, and Dai-Ichi Seiko Co., Ltd. His work includes an invention focused on improving the reliability and assembly of electric connectors.

Latest Patents

The provided information lists one patent for Wada: “Electric Connector and Manufacturing Method Thereof.” The invention uses a contact engaging part to directly hold the rear end of a conductive contact connected to a cable-shaped signal transmission medium. This structure helps prevent the contact from peeling off when the cable is subjected to external forces, such as flapping. A guide inclined surface on the engaging part helps position the cable, supporting stable mounting and more accurate assembly.

Career Highlights

Wada’s listed patent addresses both connector durability and ease of manufacture. The design combines secure contact retention with a guide that assists positioning during assembly. The provided data credits him with 1 patent.

Collaborations

The listed coworkers associated with Wada are Hiroharu Ikari and Takaki Kurachi. The patent is associated with Dai-Ichi Seiko Co., Ltd.

Conclusion

Hiroshi Wada’s documented invention combines a simple contact-retention structure with guided cable positioning to improve connector reliability and assembly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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