Hiroshi Toyoshima

Title: Hiroshi Toyoshima: Semiconductor Packaging and Signal Integrity

Introduction

Hiroshi Toyoshima is an inventor associated with Tokyo, Japan, and Renesas Electronics Corporation. His patent work addresses semiconductor-device design, particularly reducing unwanted signal coupling between input and output systems during parallel operation. His listed portfolio includes 2 patents.

Latest Patents

Toyoshima’s listed patents, “Semiconductor device with reduced cross talk” and “Semiconductor device,” describe a package-substrate arrangement intended to reduce mutual inductance from an external output signal system to an external input signal system.

The disclosed design uses multiple wiring layers to connect a semiconductor integrated circuit’s external terminals with corresponding module terminals. It places the principal input wiring in a layer facing the integrated circuit and the principal output wiring in another layer. The output-system signal wiring, which may be a source of noise, is positioned in a layer farther from the integrated circuit. This arrangement is intended to reduce cross talk while enabling parallel input/output operation.

Career Highlights

Toyoshima’s listed inventions focus on the interaction between semiconductor packaging and signal integrity. The described multilayer wiring approach addresses how the placement of signal paths can help limit interference between output and input systems.

Collaborations

The provided information lists Yasuhiro Yoshikawa and Motoo Suwa as Toyoshima’s coworkers. It does not specify their roles in the patents or describe particular collaborative projects.

Conclusion

Hiroshi Toyoshima’s listed patent work at Renesas Electronics Corporation centers on reducing cross talk in semiconductor devices through careful placement of wiring across package-substrate layers.