Company Filing History:
Years Active: 2009-2013
Title: Hiroshi Niwa: Innovator in Multilayer Printed Circuit Board Technology
Introduction
Hiroshi Niwa is a prominent inventor based in Ibi-gun, Japan. He has made significant contributions to the field of electronics, particularly in the development of multilayer printed circuit boards. With a total of four patents to his name, Niwa's work has advanced the technology used in modern electronic devices.
Latest Patents
Niwa's latest patents include innovative designs for plating apparatuses and methods for multilayer printed circuit boards. One of his notable inventions involves a multilayer printed circuit board that features an insulation layer, a first conductor layer on one side, and a second conductor layer on the opposite side. This design incorporates multiple filled vias that electrically connect the two conductor layers, with precise specifications ensuring that the difference between the lowest and highest points of the upper surfaces of the vias is less than or equal to about 7 micrometers. Another patent outlines a method for manufacturing multilayer printed circuit boards, which includes forming an electroless plated film and electrolytically plating the substrate while ensuring the formation of a through-hole conductor structure.
Career Highlights
Hiroshi Niwa is currently employed at Ibiden Company Limited, where he continues to innovate in the field of electronics. His work has been instrumental in enhancing the efficiency and reliability of printed circuit boards, which are essential components in various electronic devices.
Collaborations
Niwa collaborates with talented coworkers such as Toru Nakai and Satoru Kawai. Their combined expertise contributes to the advancement of technology within their organization.
Conclusion
Hiroshi Niwa's contributions to the field of multilayer printed circuit boards and plating technologies highlight his role as a key innovator in electronics. His patents reflect a commitment to improving the functionality and performance of electronic components.