Tokyo, Japan

Hiroshi Naganuma



Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2013-2025

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7 patents (USPTO):

Title: Innovations of Hiroshi Naganuma

Introduction

Hiroshi Naganuma is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronic component packaging, holding a total of seven patents. His work is recognized for its innovative approach to enhancing electronic component efficiency and functionality.

Latest Patents

One of Hiroshi Naganuma's latest patents involves an electronic component package that features an outer edge with a first side and a second side adjacent to each other. This package includes a first electronic component chip and a second electronic component chip positioned at a distance from each other. It also comprises one or more first terminals along the first side, one or more second terminals along the second side, and one or more first conductors. The first conductors connect the first terminals to the first electronic component chip, while the first terminals remain uncoupled from the second electronic component chip. This innovative design aims to improve the performance and reliability of electronic devices.

Career Highlights

Hiroshi Naganuma has built a successful career at TDK Corporation, where he continues to develop cutting-edge technologies. His expertise in electronic components has positioned him as a key player in the industry. His contributions have not only advanced the company's product offerings but have also influenced the broader field of electronics.

Collaborations

Hiroshi has collaborated with notable colleagues, including Hiraku Hirabayashi and Naoki Ohta. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Hiroshi Naganuma's work exemplifies the spirit of innovation in the electronics industry. His patents and collaborations reflect a commitment to advancing technology and improving electronic component design. His contributions will undoubtedly continue to shape the future of electronics.

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