Hiroshi Kumakura

Title: Hiroshi Kumakura: Innovator in Circuit Board Technology

Introduction

Hiroshi Kumakura is a notable inventor based in Tochigi, Japan. He has made significant contributions to the field of circuit board technology, showcasing his innovative spirit and technical expertise.

Latest Patents

Kumakura holds a patent for a unique circuit board design. This circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer. The resinous layer serves to electrically insulate and bond the metal substrate and the metal layer. Notably, the conductive metal layer has an elongation at break of not less than 15%, while the resinous layer includes a first resinous layer with a volume resistivity of not less than 10^10 Ω.cm and a second resinous layer with an elongation at break of not less than 100%. This innovative design allows the circuit board to maintain a desired dielectric strength and the ability to bend without causing disconnection in the metal layer.

Career Highlights

Kumakura is currently employed at Sony Corporation, where he continues to develop and refine his inventions. His work at Sony has allowed him to be at the forefront of technological advancements in electronic components.

Collaborations

One of his notable collaborators is Akira Tsutsumi. Together, they have worked on various projects that enhance the functionality and reliability of electronic devices.

Conclusion

Hiroshi Kumakura's contributions to circuit board technology exemplify his innovative mindset and dedication to advancing the field. His patent reflects a significant step forward in the design and functionality of electronic components.