The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 1987
Filed:
Nov. 18, 1986
Satoshi Takahashi, Tochigi, JP;
Akira Tsutsumi, Tochigi, JP;
Junji Suzuki, Tochigi, JP;
Hiroshi Kumakura, Tochigi, JP;
Takao Ito, Tokyo, JP;
Kenji Ohsawa, Kanagawa, JP;
Yuji Ikegami, Kanagawa, JP;
Muneyuki Haruki, Kanagawa, JP;
Nobuyuki Yasuda, Tokyo, JP;
Masayuki Ohta, Tokyo, JP;
Sony Corporation, Tokyo, JP;
Abstract
A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.