This inventor holds 1 USPTO granted patent. Top assignee: Hosokawa Yoko Co., Ltd.. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Hiroshi Kohno: Innovator in Thermal Insulating Packaging
Introduction
Hiroshi Kohno is a notable inventor based in Higashikagawa, Japan. He has made significant contributions to the field of packaging technology, particularly in thermal insulation.
Latest Patents
Kohno holds a patent for a heat-insulating packaging film, packaging bag, and packaging bag having an opening member. This innovative thermal insulating packaging film includes a base material and an open-cell layer made of polyolefin, which is disposed on one face of the base material. The open-cell layer features an average bore diameter ranging from 150 µm to 500 µm, enhancing its insulating properties.
Career Highlights
Kohno is associated with Hosokawa Yoko Co., Ltd., where he has been instrumental in developing advanced packaging solutions. His work has focused on improving the efficiency and effectiveness of packaging materials.
Collaborations
Kohno has collaborated with notable colleagues, including Hidekazu Tanaka and Daisaku Ishikawa, contributing to various projects that enhance packaging technology.
Conclusion
Hiroshi Kohno's innovative work in thermal insulating packaging has made a significant impact in the industry. His patent reflects a commitment to advancing packaging solutions that meet modern needs.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile