This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1990.
Company Filing History:
Years Active: 1990
Title: An Insight into Inventor Hiroshi Hishiki and His Innovations in Printed Wiring Boards
Introduction: Hiroshi Hishiki, an inventor based in Kanagawa, Japan, has made significant contributions to the field of printed wiring boards. His innovative work has led to the development of a unique method for manufacturing metal-core printed wiring boards, addressing critical challenges in electronics manufacturing.
Latest Patents: Hiroshi Hishiki holds one notable patent titled "Metal-core printed wiring board and a process for manufacture thereof." This patent describes a sophisticated method of printed circuit board manufacture, utilizing a combination of ceramic paper prepreg sheets and a core metal sheet with through holes. The innovative process involves laying copper foil on both sides of the core and pressing the layers together under heat, resulting in a product that boasts high heat-dissipating capacity and reliable electrical insulation.
Career Highlights: Throughout his career, Hiroshi Hishiki has been associated with Mitsubishi Denki Kabushiki Kaisha, a leading company in the electrical and electronics industry. His expertise in materials and manufacturing processes has been instrumental in advancing the capabilities of printed wiring technology.
Collaborations: Hiroshi Hishiki has worked closely with notable colleagues such as Kiyoshi Hani and Mutsuko Hayama. Their collaborative efforts have contributed to innovative solutions in the field, enhancing the overall functionality and reliability of electronic devices.
Conclusion: Hiroshi Hishiki's innovative work in developing metal-core printed wiring boards has set benchmarks in the electronics industry. His dedication to enhancing manufacturing processes and materials continues to impact the technology sector, solidifying his reputation as a distinguished inventor.