Shiga, Japan

Hiroshi Arakawa


Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 10(Granted Patents)


Location History:

  • Otsu, JP (2015)
  • Shiga, JP (2016 - 2019)

Company Filing History:


Years Active: 2015-2019

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3 patents (USPTO):Explore Patents

Title: **Hiroshi Arakawa: Innovator in Sealing Technologies**

Introduction

Hiroshi Arakawa is a distinguished inventor residing in Shiga, Japan, known for his significant contributions to sealing technology. With an impressive portfolio of three patents, Arakawa has made substantial advancements in the fields of packaging and electronic devices.

Latest Patents

Arakawa's latest patents highlight his expertise in creating airtight packages. One of his notable inventions is a manufacturing method for airtight packages, which involves forming a first sealing material layer on a glass substrate, arranging a frame body, and sealing it together. This innovative method ensures that the package remains hermetic and secure. Another key patent is a glass substrate with a sealing material layer that includes a unique composition of inorganic powder, designed to enhance the durability and effectiveness of electronic devices.

Career Highlights

Throughout his career, Hiroshi Arakawa has been instrumental in developing cutting-edge technologies at Nippon Electric Glass Co., Ltd. His innovative methods have not only showcased his inventive prowess but also contributed to the company’s reputation for excellence in glass manufacturing and electronics.

Collaborations

Arakawa has worked alongside talented colleagues such as Toru Shiragami and Noriaki Masuda, with whom he has shared ideas and collaborated on various projects. Their teamwork has been essential in driving forward the research and development efforts at Nippon Electric Glass Co., Ltd.

Conclusion

Hiroshi Arakawa’s contributions to sealing technologies solidify his position as a leading inventor in the industry. With a strong focus on innovation and collaboration, he continues to pave the way for advancements that enhance the functionality and efficiency of packaging and electronic devices.

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