The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Jul. 27, 2012
Applicants:
Noriaki Masuda, Shiga, JP;
Toru Shiragami, Shiga, JP;
Hiroshi Arakawa, Shiga, JP;
Inventors:
Assignee:
NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 8/24 (2006.01); C03C 17/04 (2006.01); H05B 33/04 (2006.01); C03B 23/24 (2006.01); C03C 3/14 (2006.01); C03C 3/19 (2006.01); C03C 8/04 (2006.01); C03C 8/08 (2006.01); C03C 27/10 (2006.01); B32B 17/06 (2006.01); C03C 17/00 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
C03B 23/245 (2013.01); B32B 17/06 (2013.01); C03C 3/14 (2013.01); C03C 3/19 (2013.01); C03C 8/04 (2013.01); C03C 8/08 (2013.01); C03C 8/24 (2013.01); C03C 17/008 (2013.01); C03C 17/04 (2013.01); C03C 27/10 (2013.01); H05B 33/04 (2013.01); H01L 51/5246 (2013.01); Y10T 428/24413 (2015.01); Y10T 428/24421 (2015.01);
Abstract
Provided is a glass substrate with a sealing material layer, including a sealing material layer formed by sintering a sealing material, in which: the sealing material includes at least inorganic powder; the inorganic powder includes glass powder and a refractory filler; the content of refractory filler in the inorganic powder is 10 to 35 vol %; and the sealing material layer has a surface roughness Ra of less than 0.5 μm.