Hiroomi Hanai

Title: Hiroomi Hanai: Innovator in Pressure-Sensitive Adhesive Technology

Introduction

Hiroomi Hanai is an inventor based in Ibaraki-shi, Japan. He has made significant contributions to the field of pressure-sensitive adhesive tapes, particularly for use in electrochemical devices. His innovative approach focuses on enhancing the performance and reliability of adhesive materials in various applications.

Latest Patent Applications

Hanai's latest patent applications include a pressure-sensitive adhesive tape designed specifically for electrochemical devices. This adhesive tape features a substrate and a pressure-sensitive adhesive layer that contains an acrylic polymer as a base. The tape is engineered to have a first and second 180° peel adhesion strength, with the first strength being measured at 25° C. and a peeling speed of 300 mm/min after bonding to a SUS 304BA plate at temperatures ranging from 40° C. to below 150° C. Notably, the first peel adhesion strength is at least twice as high as the second. Additionally, the adhesive tape is characterized by an extremely low water content, minimizing the risk of adhesive protrusion and ensuring it remains intact even when in contact with electrolytic solutions. The pressure-sensitive adhesive layer has a gel content of 60% or more and a thickness ranging from 1 to 15 μm, with a water absorption rate of 0.2% or less after immersion in water at 23° C. for 24 hours.

Conclusion

Hiroomi Hanai's work in developing advanced pressure-sensitive adhesive tapes showcases his commitment to innovation in adhesive technology. His contributions are poised to enhance the performance of electrochemical devices significantly.