Company Filing History:
Years Active: 2003
Title: Hironori Mihono: Innovator in Multilayer Printed Wiring Board Technology
Introduction
Hironori Mihono is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of electronics, particularly in the manufacturing of multilayer printed wiring boards. His innovative approach has led to the development of a method that enhances the efficiency and density of wiring boards.
Latest Patents
Mihono holds a patent for a "Method of manufacturing a multilayer printed wiring board." This invention provides a high-density multilayer printed wiring board and a method for manufacturing it with high-density wiring that is formed easily. The process involves several steps, including forming conduction holes, electrically connecting layers, and press-molding laminated structures. His patent is a testament to his expertise and creativity in the field.
Career Highlights
Hironori Mihono is associated with Sony Corporation, a leading company in the electronics industry. His work at Sony has allowed him to apply his innovative ideas and contribute to the advancement of technology in printed wiring boards. His dedication to his craft is evident in the quality and impact of his inventions.
Collaborations
Mihono has collaborated with esteemed colleagues such as Yoshio Watanabe and Nobuyuki Yasuda. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Hironori Mihono's contributions to the field of multilayer printed wiring boards exemplify the spirit of innovation. His patent and work at Sony Corporation highlight his role as a key player in advancing technology in electronics. His achievements inspire future inventors and underscore the importance of creativity in engineering.