The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2003
Filed:
Aug. 15, 2000
Yoshio Watanabe, Kanagawa, JP;
Nobuyuki Yasuda, Kanagawa, JP;
Hironori Mihono, Kanagawa, JP;
Yuji Nishitani, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
The invention provides a high-density multilayer printed wiring board and a method for manufacturing a multilayer printed wiring board having high-density wiring that is formed easily. A method for manufacturing a multilayer printed wiring board formed by laminating a plurality of laminates comprises a step for forming a conduction hole on a laminate comprising an insulating board having both sides on which conductive films are formed, a step for electrically connecting between both sides of said laminate through the above-mentioned conduction hole and planarizing the surface, a step for patterning the above-mentioned conductive film desiredly and forming a projection member at a desired position of the above-mentioned conductive film, a step for laminating bonding members having a through hole to which the above-mentioned projection member is inserted, which is served for bonding between the above-mentioned laminates, and the above-mentioned laminates alternately with insertion of the above-mentioned projection member into the above-mentioned throughhole, and a step for press-molding the above-mentioned laminated laminates and bonding members with heating.