JP

Hiromitsu Baba

This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiromitsu Baba. Retrieved from https://idiyas.com/inventor/hiromitsu-baba-d91sjzj6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


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Title: Hiromitsu Baba: Innovator in Liquid Molding Resin Technology

Introduction

Hiromitsu Baba is a notable inventor based in Japan, recognized for his contributions to the field of liquid molding resin technology. His innovative work focuses on developing advanced materials that enhance the efficiency and effectiveness of reaction injection molding processes.

Latest Patents

Hiromitsu Baba currently holds a patent for a liquid molding resin with nonswelling mica. This invention involves a liquid resin reaction monomer that includes metathesis polymerizable cycloolefin and a plurality of nonswelling mica. The nonswelling mica has an average particle size ranging from about 35 micrometers to about 500 micrometers, with a bulk density between approximately 0.10 g/ml and 0.27 g/ml. This technology aims to improve the properties of liquid molding resins, making them more suitable for various industrial applications.

Career Highlights

Hiromitsu Baba is associated with Metton America, Inc., where he continues to develop innovative materials for the manufacturing industry. His work has significantly contributed to advancements in molding technologies, showcasing his expertise in polymer science and engineering.

Collaborations

Hiromitsu collaborates with Hiroyuki Minami, working together to push the boundaries of liquid molding resin applications. Their partnership exemplifies the importance of teamwork in driving innovation within the industry.

Conclusion

Hiromitsu Baba's contributions to liquid molding resin technology highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of materials used in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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