Yokosuka, Japan

Hiromichi Okuda

This inventor holds 1 USPTO granted patent. Top assignee: Aisin Seiki Kabushiki Kaisha. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiromichi Okuda. Retrieved from https://idiyas.com/inventor/hiromichi-okuda-m0bjofsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Hiromichi Okuda: Vehicle Frame-Garnish Mounting Invention

Introduction

Hiromichi Okuda is an inventor associated with Yokosuka, Japan, and Aisin Seiki Kabushiki Kaisha. His patent work includes a vehicle component mounting structure designed to secure a frame garnish to a door window frame.

Latest Patents

Okuda is credited with 1 patent: “Mounting Structure for Frame Garnish.” The invention concerns mounting a frame garnish on a vehicle’s door window frame, which surrounds the door window glass and includes a vertical portion that overlaps the vehicle’s center pillar.

The structure uses two attachment points. A hooking portion on the garnish engages a hooking hole in the upper part of the frame’s vertical portion, while an insertion portion fits into a lower insertion hole by moving downward. This arrangement provides a defined method for attaching the garnish to the frame.

Career Highlights

Okuda’s listed patent reflects work on vehicle design and component assembly. The invention focuses on the connection between a frame garnish and a door window frame, with distinct upper and lower engagement features.

Collaborations

Koji Yoshida and Masaru Toyota are identified as Okuda’s coworkers. The available information does not specify their roles in the patent or the invention.

Conclusion

Hiromichi Okuda’s patent describes a practical mounting structure for a vehicle frame garnish, using a hooked upper connection and a downward-inserted lower connection.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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