This inventor holds 1 USPTO granted patent. Top assignee: Matsushita Electric Works, Ltd.. Active years: 1989.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1989
Title: Hirokuni Mamiya: Innovator in Plastic Molded Chip Carrier Technology
Introduction
Hirokuni Mamiya is a notable inventor based in Yokkaichi, Japan. He has made significant contributions to the field of integrated circuit packaging. His innovative work has led to the development of a unique plastic molded chip carrier package.
Latest Patents
Mamiya holds a patent for a "Plastic molded chip carrier package and method of fabricating the same." This invention features a carrier member molded from plastic material, which integrates a plurality of I/O pins and a conductor member. This design allows for efficient interconnection between the terminals of an integrated circuit chip and the corresponding I/O pins. The unitary construction is achieved through a single molding process, enhancing the manufacturing efficiency.
Career Highlights
Hirokuni Mamiya is associated with Matsushita Electric Works, Ltd., where he has contributed to advancements in electronic packaging technologies. His work has been pivotal in improving the reliability and performance of integrated circuits.
Collaborations
Mamiya has collaborated with Atsuomi Hirata, further enhancing the innovative capabilities within their field. Their partnership has fostered the development of cutting-edge technologies in chip packaging.
Conclusion
Hirokuni Mamiya's contributions to the field of integrated circuit packaging through his patented technology exemplify the importance of innovation in electronics. His work continues to influence the industry and pave the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile