This inventor holds 2 USPTO granted patents. Top assignee: Dai Nippon Printing Co., Ltd.. Active years: 2003-2005.
Company Filing History:
Years Active: 2003-2005
Title: Innovations of Hiroko Takamori
Introduction
Hiroko Takamori is a notable inventor based in Tokyo-to, Japan. He has made significant contributions to the field of materials science, particularly in the development of innovative heat sealing materials. With a total of 2 patents to his name, Takamori's work is recognized for its practical applications in various industries.
Latest Patents
Takamori's latest patents include a transparent conductive heat sealing material and a carrier tape lid using the same. The primary objective of this invention is to provide a transparent conductive heat sealing material that maintains its antistatic properties even at low humidity levels. Additionally, it offers a level of transparency that allows for visual recognition of the contents. The invention is characterized by a heat-sealable synthetic resin and conductive fine particles with a 50% particle size of up to 1.0 µm.
Career Highlights
Hiroko Takamori is currently employed at Dai Nippon Printing Co., Ltd., where he continues to innovate and develop new materials. His work has been instrumental in advancing the capabilities of heat sealing technologies.
Collaborations
Takamori has collaborated with several talented individuals, including Isao Inoue and Masumi Hyakutome, who contribute to the innovative environment at Dai Nippon Printing Co., Ltd.
Conclusion
Hiroko Takamori's contributions to the field of materials science, particularly through his patents, highlight his role as a significant inventor. His work continues to influence the industry and pave the way for future innovations.