Ageo, Japan

Hirokazu Kawamura

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirokazu Kawamura. Retrieved from https://idiyas.com/inventor/hirokazu-kawamura-o3gmvfbg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 5.0

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Company Filing History:

goldMedal1 out of 834,708 
Other
 patents

Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Hirokazu Kawamura: Innovator in Advanced Tape Technology

Introduction

Hirokazu Kawamura is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of advanced tape technology, particularly with his innovative designs that enhance the functionality of electronic components.

Latest Patents

Kawamura holds a patent for a 2-metal layer TAB tape and both-sided CSP.BGA tape. This invention features an insulating substrate with a wiring layer on both sides. The substrate is designed with evenly spaced sprocket holes along its edges and includes through-holes filled with a conductor, ensuring electrical connectivity between the conductor and the wiring layers. Notably, the design incorporates round pilot holes between the sprocket holes, enhancing its functionality.

Career Highlights

Throughout his career, Kawamura has focused on developing advanced materials and technologies that improve electronic manufacturing processes. His work has been instrumental in creating more efficient and reliable electronic components.

Collaborations

Kawamura has collaborated with esteemed colleagues such as Akira Ichiryu and Katsuhiko Hayashi. These partnerships have fostered innovation and contributed to the advancement of technology in their field.

Conclusion

Hirokazu Kawamura's contributions to tape technology exemplify the spirit of innovation. His patent for the 2-metal layer TAB tape and both-sided CSP.BGA tape showcases his commitment to enhancing electronic manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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