Hirokazu Hirai

Title: Hirokazu Hirai: Innovator in Flexible Printed Wiring Technology

Introduction

Hirokazu Hirai is a notable inventor based in Joetsu, Japan. He has made significant contributions to the field of flexible printed wiring boards, which are essential components in modern electronic devices. His innovative work has led to the development of technologies that enhance the performance and reliability of electronic circuits.

Latest Patents

Hirai holds a patent for a flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board. The objective of this invention is to provide a flexible printed wiring board that prevents adhesion of the FPC substrates in the flexure part, thereby maintaining adequate flex resistance. The patent describes a flexible printed wiring board that includes an electric insulating layer and a conductor layer, with specific surface roughness and contact angle requirements to ensure optimal performance.

Career Highlights

Hirai is associated with Arisawa Mfg. Co., Ltd., where he has been instrumental in advancing flexible printed wiring technologies. His work has not only contributed to the company's portfolio but has also set new standards in the industry. With a focus on innovation, he continues to push the boundaries of what is possible in electronic design.

Collaborations

Hirai has collaborated with notable colleagues such as Kazuhide Kita and Shuichi Fujita. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Hirokazu Hirai's contributions to flexible printed wiring technology exemplify the spirit of innovation in the electronics industry. His patent and collaborative efforts highlight the importance of teamwork in achieving technological advancements. His work continues to influence the design and functionality of modern electronic devices.