Tokyo, Japan

Hirohito Yamashita

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Electric Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirohito Yamashita. Retrieved from https://idiyas.com/inventor/hirohito-yamashita

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hirohito Yamashita: Semiconductor Module Life-Prediction Innovation

Introduction

Hirohito Yamashita is an inventor associated with Mitsubishi Electric Corporation in Tokyo, Japan. His work includes an invention focused on predicting the service life of semiconductor modules.

Latest Patents

Yamashita is credited with 1 patent: “Semiconductor Module and Life Prediction System for Semiconductor Module.” The invention aims to improve the precision of semiconductor-module life predictions. It describes a module containing IGBTs, diodes, measurement circuits that assess their characteristics, and memory that stores initial and measured characteristic values alongside predetermined degradation thresholds.

Career Highlights

The patent reflects Yamashita’s work on monitoring semiconductor components and using measured data to assess characteristic degradation. The proposed system compares stored initial values and subsequent measurements with predetermined determination values.

Collaborations

Yamashita’s listed coworkers include Masataka Shiramizu and Kazuhiro Kawahara. The patent is associated with Mitsubishi Electric Corporation.

Conclusion

Hirohito Yamashita’s patent presents a data-based approach to estimating semiconductor-module life by tracking component characteristics and evaluating their degradation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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