Company Filing History:
Years Active: 1992
Title: Hirohito Takemura: Innovator in Copper Alloy Technology
Introduction
Hirohito Takemura is a notable inventor based in Numazu, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper alloy wires. His innovative work has led to advancements in electrical wiring technology.
Latest Patents
Hirohito Takemura holds a patent for a copper alloy wire and insulated electric wires, as well as a multiple core parallel bonded wire. The copper alloy wire features a composition that includes no less than 0.01% by weight of silver (Ag) and the balance being copper (Cu) along with unavoidable impurities. This wire is prepared by drawing a wire stock with a reduction ratio of no lower than 40% and is subjected to heat treatment for half annealing. The resulting wire achieves a tensile strength of no less than 27 kg·f/mm² and an elongation of 5%. The insulated electric wire utilizes this copper alloy wire as a conductor, with an insulation layer covering it. Additionally, the multiple core parallel bonded wire consists of two or more such insulated electric wires bonded parallel to each other.
Career Highlights
Hirohito Takemura is currently employed at Fujikura Limited, a company known for its expertise in electrical and telecommunications equipment. His work at Fujikura has allowed him to focus on innovative solutions in wire technology, contributing to the company's reputation for quality and reliability.
Collaborations
Hirohito has collaborated with notable colleagues, including Akihito Kurosaka and Sueji Chabata. Their combined efforts have fostered a creative environment that encourages the development of cutting-edge technologies in the field.
Conclusion
Hirohito Takemura's contributions to copper alloy technology and electrical wiring have made a significant impact in the industry. His innovative patent and work at Fujikura Limited highlight his role as a key figure in advancing electrical engineering solutions.