The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 1992
Filed:
Jan. 25, 1991
Akihito Kurosaka, Tokyo, JP;
Sueji Chabata, Tokyo, JP;
Haruo Tominaga, Sakura, JP;
Kenichi Miyauchi, Sakura, JP;
Michio Koike, Naka, JP;
Takashi Nishida, Numazu, JP;
Hirohito Takemura, Numazu, JP;
Toshihito Watanabe, Numazu, JP;
Kazumichi Kasai, Shizuoka, JP;
Takao Tsuboi, Shizuoka, JP;
Fujikura Ltd., Tokyo, JP;
Abstract
A copper alloy wire has a composition composed of no less than 0.01% by weight of Ag and balance Cu and unavoidable impurities. The copper alloy wire has been prepared by drawing a wire stock having the composition at a reduction ratio of no lower than 40% and subjecting the wire stock to heat treatment for half annealing to have a tensile strength of no lower than 27 kg.multidot.f/mm.sup.2 and an elongateion of 5%. An insulated elecric wire includes the copper alloy wire as a conductor and an insulation layer covering the wire. Also, a multiple core parallel bonded wire includes two or more such insulated electric wires bonded parallel to each other.