Location History:
- Machida, JP (1990 - 1995)
- Tokyo-to, JP (2001 - 2002)
- Shinjuku-Ku, JP (2005)
- Tokyo, JP (1989 - 2024)
Company Filing History:
Years Active: 1989-2024
Title: Hirofumi Tomita: Innovator in Circuit Design and Transfer Materials
Introduction
Hirofumi Tomita is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of circuit design and transfer materials, holding a total of 9 patents. His innovative work has paved the way for advancements in various technologies.
Latest Patents
Among his latest patents is a bias tee circuit, which is designed to connect a common terminal with power supply and signal terminals. This circuit features a capacitor inserted between the common terminal and the signal terminal, along with first and second inductors arranged in series. The first inductor is connected to the common terminal, while the second inductor, which has a higher self-resonance frequency and lower Q value than the first, is connected to the power supply terminal.
Another notable patent involves a receptor layer transfer material, which allows for the free combination of holograms and colorful images through an on-demand printing system. This material includes a release layer, a relief forming layer with a reflection layer, and an adhesive layer, all stacked on one surface of a substrate. This innovation enhances the capabilities of thermal transfer methods in image formation.
Career Highlights
Hirofumi Tomita has worked with several esteemed companies throughout his career. Notably, he has been associated with Dai Nippon Printing Co., Ltd. and Mitsubishi Kasei Corporation. His experience in these organizations has contributed to his expertise in developing cutting-edge technologies.
Collaborations
Tomita has collaborated with notable individuals in his field, including Masatsugu Oda and Toshiro Sakaki. These partnerships have fostered a creative environment that has led to the development of innovative solutions.
Conclusion
Hirofumi Tomita's contributions to circuit design and transfer materials exemplify his innovative spirit and dedication to advancing technology. His patents reflect a commitment to enhancing functionality and creativity in various applications.