Hyogo, Japan

Hirofumi Kojima

This inventor holds 1 USPTO granted patent. Top assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Semiconductor Software Co., Ltd. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirofumi Kojima. Retrieved from https://idiyas.com/inventor/hirofumi-kojima-tsudyld7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1998

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Hirofumi Kojima: Semiconductor Circuit Inventor.

Introduction

Hirofumi Kojima is an inventor associated with Hyogo, Japan. His work includes a patented semiconductor integrated circuit design focused on increasing cell density.

Latest Patents

Kojima is credited with 1 patent, titled “Semiconductor Integrated Circuit Including a High Density Cell.” The invention describes a semiconductor integrated circuit device with a more densely integrated layout. It combines cells with the same circuit configuration while allowing them to share a basic gate portion.

Career Highlights

Kojima’s listed company affiliations include Mitsubishi Electric Semiconductor Software Co., Ltd. and Mitsubishi Electric Corporation. These affiliations place his work in the semiconductor and electronics industry.

Collaborations

Kojima’s listed coworker is Yutaka Kamakura. Their shared professional context is associated with semiconductor-related work.

Conclusion

Hirofumi Kojima’s patent documents an approach to denser semiconductor integration through shared gate structures, reflecting his contribution to circuit design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…