Hiroaki Ohta

Title: Innovations by Hiroaki Ohta

Introduction

Hiroaki Ohta is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of technology, particularly in chip singulation methods. With a total of two patents to his name, Ohta's work reflects his dedication to advancing semiconductor manufacturing processes.

Latest Patents

Hiroaki Ohta's latest patents focus on a chip singulation method. This method includes several steps: forming a surface supporting layer on the upper surface of a wafer, thinning the wafer from the undersurface to reduce its thickness to at most 30 μm, and removing the surface supporting layer from the upper surface. Additionally, it involves forming a first metal layer and subsequently a second metal layer on the undersurface of the wafer. The process continues with applying a dicing tape onto the undersurface of the second metal layer, increasing the hydrophilicity of the wafer's surface, and forming a water-soluble protective layer on the surface. The wafer, along with the metal layers, is then cut by irradiating a predetermined region of the upper surface with a laser beam, followed by the removal of the water-soluble protective layer using wash water.

Career Highlights

Hiroaki Ohta is currently employed at Nuvoton Technology Corporation Japan. His work at this company has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of his notable coworkers include Takeshi Harada and Yoshihiro Matsushima. Their combined expertise contributes to the innovative environment at Nuvoton Technology Corporation Japan.

Conclusion

Hiroaki Ohta's contributions to chip singulation methods demonstrate his commitment to innovation in technology. His patents reflect a deep understanding of semiconductor processes, positioning him as a key figure in the industry.