Honjo, Japan

Hikaru Hayashida

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Dowa Electronics Materials., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hikaru Hayashida. Retrieved from https://idiyas.com/inventor/hikaru-hayashida

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hikaru Hayashida: Innovator in Silver Powder Technology

Introduction

Hikaru Hayashida is a notable inventor based in Honjo, Japan. He has made significant contributions to the field of materials science, particularly in the development of silver powder. His innovative approach has led to advancements that enhance the physical properties of silver powder used in various applications.

Latest Patents

Hikaru Hayashida holds a patent for a silver powder and the method of producing it. This patent describes a silver powder that possesses powder physical properties enabling a reduction of volume resistivity after firing. The silver powder features a tap density of 4.8 g/mL or more, a TAP/D50 value ranging from 7 to 15, and a specific surface area between 0.75 m/g and 1.3 m/g.

Career Highlights

Hikaru Hayashida is currently employed at Dowa Electronics Materials, Ltd., where he continues to innovate in the field of electronic materials. His work focuses on enhancing the performance and efficiency of materials used in electronic applications.

Collaborations

Hikaru collaborates with Kaori Tokusada, contributing to the advancement of their projects and research initiatives.

Conclusion

Hikaru Hayashida's contributions to silver powder technology exemplify his commitment to innovation in materials science. His patent reflects a significant advancement that could impact various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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