Hiep Diep-Quang

Title: Hiep Diep-Quang: Innovator in VOC-Free Soldering Flux

Introduction

Hiep Diep-Quang is a notable inventor based in Jersey City, NJ (US). He has made significant contributions to the field of soldering materials, particularly with his innovative approach to creating environmentally friendly soldering flux.

Latest Patents

Hiep Diep-Quang holds a patent for an epoxy-based, VOC-free soldering flux. This unique formulation consists of 40 to 50 wt % of a liquid epoxy resin, 25 to 30 wt % of a non-volatile liquid epoxy diluent, 20 to 33 wt % of a polyfunctional carboxylic acid, and 2.0 to 3.5 wt % of a thixotropic agent. The absence of volatile organic solvents or compounds in the flux ensures that no harmful emissions occur during the reflow process. The carboxylic acids are provided in powdered form and remain suspended in the epoxy blend until heated. The resulting VOC-free solder paste consists of 40 to 95 wt % soldering particles and 5 to 60 wt % of the soldering flux. Additionally, the thixotropic agent enhances the printability of the solder paste on printed wiring boards.

Career Highlights

Hiep Diep-Quang is currently associated with Fry Metals, Inc., where he continues to develop innovative soldering solutions. His work focuses on creating products that not only meet industry standards but also prioritize environmental safety.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Hiep Diep-Quang's contributions to the field of soldering materials, particularly through his VOC-free soldering flux, highlight his commitment to innovation and environmental responsibility. His work at Fry Metals, Inc. continues to pave the way for safer and more effective soldering solutions.