Osaka, Japan

Hideyuki Yamakoshi

This inventor holds 1 USPTO granted patent. Top assignee: Henkel Corporation. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideyuki Yamakoshi. Retrieved from https://idiyas.com/inventor/hideyuki-yamakoshi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2012

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Hideyuki Yamakoshi

Introduction

Hideyuki Yamakoshi is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of adhesives, particularly with his innovative moisture-curable hot melt adhesive. His work emphasizes environmental friendliness and high performance, making it valuable across various industries.

Latest Patents

Yamakoshi holds 1 patent for his moisture-curable hot melt adhesive. This adhesive boasts an excellent balance of environmental compatibility, early-stage adhesive strength, and heat resistance after moisture curing. The formulation includes a urethane polymer with a terminal isocyanate group and a urethane modified resin, ensuring a low residual percentage of isocyanate compound. This innovative adhesive is particularly useful in building materials, electronics, and the automotive field.

Career Highlights

Yamakoshi is currently employed at Henkel Corporation, where he continues to develop advanced adhesive technologies. His expertise in creating high-performance adhesives has positioned him as a key player in the industry.

Collaborations

Yamakoshi collaborates with Tsuyoshi Tamogami, enhancing the innovation process and contributing to the development of new adhesive solutions.

Conclusion

Hideyuki Yamakoshi's contributions to adhesive technology reflect his commitment to innovation and environmental sustainability. His work continues to impact various industries positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…