Otsu, Japan

Hideyuki Osamura

This inventor holds 1 USPTO granted patent. Top assignees: Bridgestone Corporation, Tokuden Co., Ltd.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideyuki Osamura. Retrieved from https://idiyas.com/inventor/hideyuki-osamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2017

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Hideyuki Osamura: Inventor of an Induction Heating Device for Molds

Introduction

Hideyuki Osamura is an inventor associated with Otsu, Japan. His work includes an invention designed to heat molds efficiently and uniformly while protecting induction coils from corrosive gases. He is credited with 1 patent.

Latest Patents

Osamura’s patent, “Induction Heating Device for Mold,” describes upper and lower plates that contact the corresponding end faces of a mold. Each plate contains an induction coil powered by a commercial power supply. The coil sits in a recessed housing in the plate’s metal body, which is closed by a cover. A stepped cover-placement area accommodates the cover, while jacket chambers in the metal body contain a gas-liquid two-phase heating medium. Together, these features support uniform mold heating and help shield the coils from corrosive gases.

Career Highlights

Osamura has been associated with Tokuden Co., Ltd. and Bridgestone Corporation. His patented work reflects an engineering focus on practical mold-heating equipment and the protection of its components.

Collaborations

Yasuhiro Fujimoto and Akihiko Hajikano are identified as Osamura’s coworkers.

Conclusion

Hideyuki Osamura’s patent presents a mold-heating design that combines induction coils, protective covers, and jacket chambers to promote efficient, uniform heating and coil protection.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…