Ritto, Japan

Hideyuki Nomi

This inventor holds 1 USPTO granted patent. Top assignee: Ishida Co. Limited. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideyuki Nomi. Retrieved from https://idiyas.com/inventor/hideyuki-nomi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations by Hideyuki Nomi in Packaging Technology.

Introduction

Hideyuki Nomi is a notable inventor based in Ritto, Japan. He has made significant contributions to the field of packaging technology. His innovative approach focuses on enhancing the quality of printed films used in packaging processes.

Latest Patents

Nomi holds a patent for a packaging apparatus designed to inhibit a reduction in printing quality with respect to a film. This apparatus includes a film conveyance device that conveys a film, a moving mechanism for conveying a container, and a sealing device that seals the container's opening with the film. Additionally, a printer is positioned upstream of the sealing device to print information on the film while it is being conveyed. The controller manages the operation of the film conveyance device, ensuring that the film is temporarily accumulated for optimal packaging operations.

Career Highlights

Hideyuki Nomi is associated with Ishida Co. Limited, a company known for its advancements in packaging solutions. His work has contributed to the development of efficient packaging systems that maintain high-quality standards.

Collaborations

Nomi collaborates with talented coworkers such as Tomohiko Seno and Naoki Komai, who contribute to the innovative environment at Ishida Co. Limited.

Conclusion

Hideyuki Nomi's contributions to packaging technology exemplify the importance of innovation in maintaining quality standards in the industry. His patent reflects a commitment to enhancing the efficiency and effectiveness of packaging processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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