Toyota, Japan

Hideyuki Murayama



 

Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 72(Granted Patents)


Location History:

  • Toyota, JP (2011 - 2013)
  • Owariasahi, JP (2013)
  • Seto, JP (2021 - 2022)

Company Filing History:


Years Active: 2011-2022

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7 patents (USPTO):Explore Patents

Title: Innovations by Hideyuki Murayama

Introduction

Hideyuki Murayama is a notable inventor based in Toyota, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His work focuses on enhancing the efficiency and functionality of semiconductor modules and bonding methods.

Latest Patents

One of Murayama's latest patents is a semiconductor module structure. This innovative design includes a semiconductor element portion with multiple capacitor elements, two bus bars that sandwich the semiconductor element portion, and conductive cooling fins on the bus bars. Insulating refrigerant is also integrated into the cooling fins to improve thermal management. Another significant patent is for a semiconductor element bonding apparatus and method. This invention ensures that bonding material does not protrude while maintaining adhesion, even with variations in thickness or surface irregularities. The apparatus features means for disposing of a workpiece and semiconductor element, vertical movement capabilities, and measuring systems for displacement and contact load.

Career Highlights

Murayama has worked with prominent companies, including Toyota Motor Corporation and Araki Manufacturing Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Murayama has collaborated with talented individuals such as Hitoshi Yamamoto and Ken-ichi Fujino. These partnerships have contributed to the advancement of his projects and the successful development

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