The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
Jul. 09, 2020
Applicant:
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Inventors:
Tomo Sasaki, Susono, JP;
Hideyuki Murayama, Seto, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 25/07 (2006.01); H01L 23/367 (2006.01); H01L 23/50 (2006.01); H01L 25/11 (2006.01); H01L 23/433 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); H02M 7/537 (2006.01); H02M 7/48 (2007.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/3672 (2013.01); H01L 23/50 (2013.01); H01L 25/071 (2013.01); H01L 28/40 (2013.01);
Abstract
A semiconductor module structure includes: a semiconductor element portion including a plurality of capacitor elements; two bus bars sandwiching the semiconductor element portion and being electrically connected to the semiconductor element portion; and cooling fins, which are conductive, formed on respective surfaces of the bus bars at positions sandwiching the semiconductor element portion. Further, insulating refrigerant is provided in the cooling fins.