US

Hideyuki Kawase

This inventor holds 1 USPTO granted patent. Top assignee: Ngb Spark Plug Co., Ltd.. Active years: 1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideyuki Kawase. Retrieved from https://idiyas.com/inventor/hideyuki-kawase-mm2htbaf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1991

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1 patent (USPTO):Explore Patents

Title: Innovations by Hideyuki Kawase

Introduction

Hideyuki Kawase is a notable inventor based in the United States. He has made significant contributions to the field of bonding technologies, particularly through his innovative methods of producing joined articles.

Latest Patents

Kawase holds a patent for a method of producing a joined article through bonding with low melting point glass. This method involves using a low-melting point glass to join multiple articles, where recesses in the glass layer are formed before joining. These recesses help reduce the entrapment of bubbles within the glass layer, enhancing the quality of the bond. The recesses are preferably created by protrusions in a mask used during the coating process of the low-melting point glass.

Career Highlights

Kawase is associated with Ngb Spark Plug Co., Ltd., where he applies his expertise in bonding technologies. His work has been instrumental in advancing the methods used in the production of joined articles, showcasing his innovative approach to problem-solving in engineering.

Collaborations

Kawase has collaborated with notable colleagues, including Noboru Sahashi and Tamotsu Hashizume. Their combined efforts have contributed to the development of advanced bonding techniques and have fostered a collaborative environment for innovation.

Conclusion

Hideyuki Kawase's contributions to the field of bonding technologies through his innovative patent demonstrate his commitment to advancing engineering practices. His work continues to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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