Hidetoshi Takeda

Title: Hidetoshi Takeda: Innovator in Polishing Technology

Introduction

Hidetoshi Takeda is a notable inventor based in Omura, Japan. He has made significant contributions to the field of polishing technology, holding a total of 2 patents. His work focuses on improving the efficiency and effectiveness of polishing apparatuses used in various applications.

Latest Patents

One of Hidetoshi Takeda's latest patents is a polishing apparatus that includes a polishing plate, an abrasive cloth attached to the surface of the polishing plate, and a chuck for holding and pressing one surface of a wafer against the abrasive cloth. This innovative design features a circular retaining ring that is concentrically arranged on the periphery of the chuck. The retaining ring is both rotatable and vertically movable with respect to the chuck. During the lapping step, it is pressed against the abrasive cloth, while it is lifted upward during the final polishing step. This mechanism prevents lapping grains from contaminating the final polishing stage. As a result, lapping and final polishing can be conducted successively using the same polishing head, leading to cost savings and increased efficiency.

Career Highlights

Hidetoshi Takeda is currently employed at Sumco Techxiv Corporation, where he continues to develop innovative polishing solutions. His expertise in this area has positioned him as a key figure in the advancement of polishing technology.

Collaborations

Throughout his career, Hidetoshi has collaborated with notable colleagues, including Masamitsu Kitahashi and Toshiyuki Kamei. These collaborations have further enhanced his contributions to the field.

Conclusion

Hidetoshi Takeda's work in polishing technology exemplifies innovation and efficiency. His patents reflect a commitment to advancing the industry and improving processes. His contributions will likely continue to influence the field for years to come.