Yokohama, Japan

Hidetoshi Mizuta

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Hidetoshi Mizuta: Innovator in Bonding Methods

Introduction

Hidetoshi Mizuta is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of bonding methods, showcasing his expertise through innovative solutions.

Latest Patents

Mizuta holds a patent for a bonding method that effectively bonds a buffer member to an adherend member. This method includes several steps: an adhesive application step, a first heating step, a second heating step, and an attachment step. This systematic approach enhances the efficiency and effectiveness of the bonding process.

Career Highlights

Mizuta is associated with Nhk Spring Co., Ltd., where he applies his skills and knowledge to develop advanced bonding techniques. His work has been instrumental in improving product reliability and performance in various applications.

Collaborations

Mizuta collaborates with talented coworkers, including Atom Furuse and Kaoru Nagasawa. Their combined efforts contribute to the innovative environment at Nhk Spring Co., Ltd.

Conclusion

Hidetoshi Mizuta's contributions to bonding methods reflect his dedication to innovation and excellence in engineering. His patent and collaborative efforts continue to influence the industry positively.

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