The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Oct. 06, 2022
Applicant:
Nhk Spring Co., Ltd., Yokohama, JP;
Inventors:
Hidetoshi Mizuta, Yokohama, JP;
Atom Furuse, Yokohama, JP;
Kaoru Nagasawa, Yokohama, JP;
Fumitaka Arai, Yokohama, JP;
Assignee:
NHK Spring Co., Ltd., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/14 (2006.01); B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/1416 (2013.01); B29C 66/742 (2013.01); B60G 2206/821 (2013.01);
Abstract
A bonding method bonds a buffer member to an adherend member, and includes: an adhesive application step of applying an adhesive to a part of the buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.