Wako, Japan

Hidetaka Kayanuma


 

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 45(Granted Patents)


Location History:

  • Saitama, JP (1999 - 2002)
  • Wako, JP (2002 - 2016)

Company Filing History:


Years Active: 1999-2016

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8 patents (USPTO):Explore Patents

Title: Hidetaka Kayanuma: Innovator in Absorption Heat Pump Technology

Introduction

Hidetaka Kayanuma is a notable inventor based in Wako, Japan. He has made significant contributions to the field of absorption heat pump technology, holding a total of 8 patents. His innovative designs focus on improving energy efficiency and reducing heat loss in various applications.

Latest Patents

One of Kayanuma's latest patents is an absorption heat pump with a thermally insulating dividing wall. This invention features a boiler-equipped absorption heat pump unit where high-temperature devices are separated from low-temperature devices by an insulated dividing wall. This design effectively reduces heat loss by impeding the transfer of heat between these devices. Another significant patent is a coupling structure for an absorption refrigeration circuit. This structure includes a gasket held between two coupling members, which has a protruding part that elastically deforms when clamped, ensuring a secure connection.

Career Highlights

Throughout his career, Hidetaka Kayanuma has worked with prominent companies such as Honda Giken Kogyo Kabushiki Kaisha and Honda Motor Co., Ltd. His work in these organizations has allowed him to develop and refine his innovative ideas in the field of heat pump technology.

Collaborations

Kayanuma has collaborated with notable coworkers, including Mitsuru Ishikawa and Toshimitsu Takaishi. These partnerships have contributed to the advancement of his inventions and the overall progress in absorption refrigeration technology.

Conclusion

Hidetaka Kayanuma's contributions to absorption heat pump technology demonstrate his commitment to innovation and energy efficiency. His patents reflect a deep understanding of thermal dynamics and a dedication to improving existing technologies.

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