Osaka, Japan

Hideo Ishii

This inventor holds 32 USPTO granted patents, primarily in Power Supply Apparatus. Top assignees: Sansha Electric Manufacturing Company, Limited, Thermal Dynamics Corporation. Active years: 1980-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideo Ishii. Retrieved from https://idiyas.com/inventor/hideo-ishii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 13

Forward Citations = 385(Granted Patents)


Location History:

  • Toyonaka, JP (1980)
  • Minoo, JP (1998 - 2003)
  • Osaka, JP (2003 - 2014)

Company Filing History:


Years Active: 1980-2014

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Areas of Expertise:
Arc Welding
Heat Sink Arrangement
Power Supply Apparatus
High-Frequency Transformer
Cooling Structure
DC Power Supply
Welding Method
Coil
Casting Apparatus
Inverter
32 patents (USPTO):Explore Patents

Title: Hideo Ishii: Innovator in Arc Welding and Electrical Apparatus Design

Introduction

Hideo Ishii, a prolific inventor based in Osaka, Japan, has made significant contributions to the fields of welding technology and electrical apparatus design. With a total of 32 patents to his name, his innovations have revolutionized various aspects of manufacturing and engineering processes.

Latest Patents

Among his latest inventions, the "Arc Welding Apparatus and Method" stands out. This innovative apparatus includes a main power supply circuit that outputs an arc current, enhanced by a control circuit that manages its operation. A distinctive feature of this apparatus is the high-frequency voltage generating circuit, which allows for a smooth arc transition by superimposing high voltage on the generated high-frequency voltage during the welding process.

Additionally, Ishii holds a patent for a "Heat Sink Arrangement for Electrical Apparatus." This design features a printed circuit board composed of an insulating substrate with conductive films. It incorporates semiconductor devices positioned externally to the board, with their leads connected to the conductive films. This arrangement optimizes thermal management and enhances the reliability of electrical devices.

Career Highlights

Ishii has worked with notable companies throughout his career, including Sansha Electric Manufacturing Company, Limited, and Thermal Dynamics Corporation. His extensive experience in these firms has significantly influenced his innovative capabilities, allowing him to develop cutting-edge technologies that address complex engineering challenges.

Collaborations

Throughout his career, Ishii has collaborated with esteemed inventors such as Tetsuro Ikeda and Masao Katooka. These partnerships have fostered a creative environment for the development of advanced technologies, enabling breakthroughs in their respective fields.

Conclusion

Hideo Ishii's extensive patent portfolio and collaborations demonstrate his commitment to innovation and excellence in engineering. His contributions to arc welding and electrical apparatus design continue to impact the industry, setting new standards for efficiency and performance. Ishii's work exemplifies the role of inventors in shaping the future of technology through creativity and dedication.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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