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For the Inventor, By the Inventor

Kyoto, Japan

Hideo Ikuta

This inventor holds 9 USPTO granted patents and 1 published patent application. Top assignee: Cyntec Company. Active years: 2011-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideo Ikuta. Retrieved from https://idiyas.com/inventor/hideo-ikuta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 100.0

Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 7(Granted Patents)


Location History:

  • Hsin Chu, TW (2011 - 2014)
  • Taiwan, JP (2014)
  • Kyoto, JP (2013 - 2020)

Company Filing History:

goldMedal9 out of 231 
 
Cyntec Company
 patents

Years Active: 2011-2020

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9 patents (USPTO):Explore Patents
1. 10658102 - Electronic device and manufacturing method thereof (2020-05-19),
2. 10204730 - Electronic device and manufacturing method thereof (2019-02-12),
3. 9481037 - Electronic device and manufacturing method thereof (2016-11-01),
4. 9381573 - Electronic device and manufacturing method thereof (2016-07-05),
5. 9000879 - Electronic device and manufacturing method thereof (2015-04-07),
6. 8922312 - Electronic device and manufacturing method thereof (2014-12-30),
7. 8771436 - Electronic device and manufacturing method thereof (2014-07-08),
8. 8518190 - Electronic device and manufacturing method thereof (2013-08-27),
9. 8018318 - Resistive component and method of manufacturing the same (2011-09-13),

Title: Hideo Ikuta: Innovator in Electronic Device Manufacturing

Introduction

Hideo Ikuta is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of electronic device manufacturing, holding a total of 9 patents. His innovative approaches have paved the way for advancements in technology.

Latest Patents

Ikuta's latest patents focus on methods for manufacturing electronic devices. One notable patent describes a method that involves providing a conducting wire and forming a mixture with the conducting wire buried within it. This mixture consists of a first magnetic powder and a second magnetic powder, where the mean particle diameter of the first magnetic powder is greater than that of the second. Additionally, the Vicker's Hardness of the first magnetic powder exceeds that of the second by a specified hardness difference. The process culminates in a molding procedure that combines the conducting wire and the mixture to create an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Career Highlights

Hideo Ikuta is currently associated with Cyntec Company, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and effectiveness of electronic devices.

Collaborations

Ikuta has collaborated with notable colleagues such as Wen-Hsiung Liao and Roger Hsieh. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Hideo Ikuta's contributions to electronic device manufacturing exemplify the spirit of innovation. His patents reflect a deep understanding of materials and processes that drive technological advancement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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