This inventor holds 1 USPTO granted patent. Top assignee: Sae Magnetics (h.k.) Limited. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: Hidenobu Takemoto: Innovator in Electronic Component Packaging
Introduction
Hidenobu Takemoto is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic component packaging. His innovative designs focus on enhancing the functionality and efficiency of electronic circuits.
Latest Patents
Hidenobu Takemoto holds a patent for an electronic component package. This package includes a substrate with at least one electronic circuit, a sealing resin for protecting the circuit, and a metal film that shields against environmental electromagnetic noise. The design also meets the lightweight requirements for integrated circuit modules. His patent is a testament to his commitment to advancing technology in the electronics industry.
Career Highlights
Hidenobu Takemoto is currently employed at Sae Magnetics (H.K.) Limited. His work at this company has allowed him to apply his innovative ideas in practical applications. He has demonstrated a strong ability to develop solutions that address industry challenges.
Collaborations
Hidenobu has collaborated with Akio Nakao, further enhancing the scope of his projects and innovations. Their partnership has contributed to the development of advanced electronic components.
Conclusion
Hidenobu Takemoto is a distinguished inventor whose work in electronic component packaging has made a significant impact on the industry. His innovative patent showcases his expertise and dedication to improving electronic technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile