Osaka, Japan

Hidenobu Harima

This inventor holds 3 USPTO granted patents and 2 published patent applications, plus 3 CIPO patents and 2 EPO patents. Top assignees: Osaka Sealing Printing Co., Ltd., Osaka Sealing Printing Co., Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hidenobu Harima. Retrieved from https://idiyas.com/inventor/hidenobu-harima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

 

 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018-2026

Loading Chart...
Loading Chart...
Loading Chart...
3 patents (USPTO):Explore Patents

Title: Hidenobu Harima: Innovator in Packaging Technology

Introduction

Hidenobu Harima is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of packaging technology, holding two patents that showcase his innovative approach to packaging solutions.

Latest Patents

Hidenobu Harima's latest patents include a packaging sheet and a packaging container, along with a packaging method utilizing the packaging sheet. These inventions eliminate the need for printed labels, preventing issues such as disappearance or color development due to friction after thermal printing. The packaging sheet consists of a heat seal layer for thermally welding by heating, a heat-sensitive layer that develops color upon heating, and a base material layer that provides strength and protection to the heat-sensitive layer. The transparent adhesive sheet he developed allows for printing during use while maintaining high transparency. It features an adhesive layer on the back surface and a release layer on the front surface, ensuring functionality and ease of use.

Career Highlights

Hidenobu Harima is associated with Osaka Sealing Printing Co., Ltd., where he continues to innovate in packaging technology. His work has significantly impacted the industry, providing solutions that enhance the efficiency and effectiveness of packaging materials.

Collaborations

Hidenobu has collaborated with notable coworkers, including Shinichi Ono and Hidenao Takeuchi, contributing to the advancement of packaging technologies through teamwork and shared expertise.

Conclusion

Hidenobu Harima's contributions to packaging technology through his innovative patents reflect his dedication to improving packaging solutions. His work continues to influence the industry, showcasing the importance of innovation in everyday products.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…